Category: Intellectual Property

Learning from an old dog? Easier IP (SIP, VIP, ESIP) integration

Bill Martin, E-System Design: This past weekend, I needed to replace a Ground Fault Interrupter, GFI for short, outlet in my garage. The last time I replaced one was several years ago in my sister’s condo. GFI outlets are a little trickier than standard outlets, but can be swapped out pretty easily. Continue reading

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IoT – The Next Market Driver

Jack Browne, Marketing Guru: Fueling the Internet of Things (IOT) is the next semiconductor growth opportunity with opportunities for the billions of M2M (Machine-to-Machine) connected devices as well as the smart devices that provide the man-machine User experience. System companies offer consumer benefits by leveraging the IOT nodes; teasing out valuable information using big data, crowd sourcing and location information. One example, as shared recently by EETimes reporter Peter Clarke explored Connected Cars updating commuting conditions and drive times analyzing crowd sourced data of driver’s usage of wipers, defrosters, brakes, etc. Continue reading

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Maximizing the Value of Your Internal IP

Warren Savage, CEO, IPextreme: Everyone today understands the essential importance of third-party semiconductor intellectual property (IP) to the health of the semiconductor industry. Considerably less attention is given to the importance of a strong, serviceable portfolio of internal IP within a semiconductor company. Continue reading

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GSA Working Groups – January Meeting News

Harrison Beasley, GSA Working Groups: GSA working groups for Intellectual Property and 3D IC kicked off 2013 meetings on January 23rd. The 3D IC group saw a significant increase in attendance with seven new companies joining the effort. These new members helped offset absent regular members attending 3D IC conferences in Europe and Singapore. Continue reading

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Brave New World: 2.5/3D packaging impact on IP?

Bill Martin, E-System Design: Let us assume that 2.5/3D packaging will become main stream. 2.5/3D concerning packaging applies to using Package on Package (PoP), System in Package (SiP) and/or TSV/CGA interposers to dramatically shrink or completely eliminate a printed circuit board. Yes, we are not there yet but the momentum and benefits exist to drive this to a reality. Over the next few years, these new packaging capabilities will impact every aspect of high tech development. How will this packaging revolution affect this ecosystem? It can open up many opportunities and challenges for various participants. Continue reading

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High Speed Interface IP Qualification: Pitfalls & Best Practices

Performing responsible IP due diligence before selection and acquisition provides high impact benefits for the SoC company and end-user equipment supplier. Many SoC companies do not have a dedicated team or a comprehensive & systematic methodology to adequately drive IP selection. This is one reason companies still suffer unplanned delays & increased cost in SoC tapeout, production ramp, and end-user equipment shipments. Continue reading

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Making IP Work and Getting the Right SoC!

Jack Browne, Vice President, Marketing, Sonics, Inc.

Designers defining the next generation SoCs are adding more cores in pursuit of the ever increasing user experience. Whether for pacesetting smart phones, WiFi routers, or personal medical devices, making all this IP work as intended in the SoC requires system IP. System IP includes the on-chip network, performance analysis tools, debug tools, power management and memory subsystems necessary for best in class SoCs. Whether used by the architect in the initial definition of the SoC or the layout engineer finalizing timing for place and route closure, system IP is critical to the design insuring that the capabilities of the SoC will meet the required end user experiences. Continue reading

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Protocols of Convenience

Ed Bard, Sr. Director of Marketing, Synopsys Inc.

It is natural to think of standards-based interface IP as convenient. That is their primary purpose – to make it easy for developers and users to interoperate with many devices from many different suppliers. But there are other types of convenience as well. Jeff Ravencraft, the president of the USB Implementers Forum (USB-IF), once told me that USB is convenient because everyone’s mother knows how to use it. USB is amazingly user friendly, you (or your mom) plug it into a camera, phone, disk drive, etc. and it just works. It can be hot-plugged in and out and when drivers aren’t installed they almost always auto install for you. Another type of convenience is technological convenience – good technology that can be adapted for many purposes. Continue reading

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Foundry and IP Business Model: Alive and Well

Dr. John Heinlein, Vice President, Marketing, ARM Physical IP Division

In 1897, after a journalist erroneously reported the passing of famed author and humorist Mark Twain, Twain replied in his typical wit with the now famous retort: “the rumor of my death has been greatly exaggerated.” Like the then very alive author, recent reports have speculated on the demise of the foundry and IP business model. I similarly think such talk is pure nonsense. Across many metrics the foundry and IP space is alive and well and providing unprecedented capabilities to semiconductor companies. Continue reading

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Leapfrogging The Competition Through Smart IP Selection

Nikos Zervas, VP of Marketing, CAST, Inc.

The adoption of a reliable design reuse methodology, proliferation of high-quality IP products, and shake-out of the most untrustworthy IP vendors creates a situation offering a huge potential advantage to system integrators and product designers looking to jump ahead of their competition. Continue reading

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